Table of Content
 

 

Resistors 

  • Wire-wound resisters 
  • Carbon composition resisters 
  • Metal film resisters 
  • Carbon film resistors 
  • Specification of resistors
  • PTC resistors ( Sensistors )
  • NTC resistors (Thermistors)
  • VDR (varistors)
  • Light dependent resistors (LDR)
  • Marketing codes for resistors 
  • Resistors and tolerance value of color coded resistors
  • Resistance value 
  • Tolerance value 

Capacitors 

  • Construction
  • Function
  • How a capacitor stores charge ?
  • capacitance
  • Sub-units of a farad 
  • Factors determining capacitance 
  • Area of the plates
  • Distance between the plates 
  • Type of dielectric material
  • Temperature 
  • Types of capacitors 
  • Common defects in capacitors 

PN junction diodes 

  • PN junction 
  • The internal barrier potential (VB)
  • Biasing the PN junction 
  • V-I characteristic of PN junction 
  • Application of diodes 
  • Important specifications of diodes
  • The material 
  • Maximum safe reverse voltage 
  • Maximum average forward current 
  • Forward voltage drop 
  • Maximum reverse current 
  • Maximum forward surge current 
  • The maximum junction temperature 
  • Manufacturer’s code of Diodes 
  • Diode equivalent 
  • Classification of Diodes 
  • Types of diode packaging 

Transistors and their classification

  • Introduction to Transistors
  • Based on semiconductor used 
  • Based on the way P and N junction are organized 
  • Based on the power handling capacity of transistors 
  • Based on the frequency of application 
  • Based on the manufacturing method 
  • Based on the type of final packaging 
  • INSIDE A TRANSISTOR 
  • TESTING TRANSISTORS USING OHMMETER 
  • Junction test 
  • Quick TURN-ON test 

Printed circuit boards (PCBS) 

  • Limitations of Tag-Lug boards 
  • Printed circuit boards 

Printed circuit boards – etching, component side marking and mounting components 

  • Etching 
  • Drilling holes on PCBs 
  • Preparing and marking component layout 
  • Mounting components on PCB 
  • Shaping the component leads 
  • Due to the component weight 
  • Due to shock 
  • Due to vibration 
  • Due to temperature 
  • Stress relief measures 
  • Order of soldering components

Types of electronic circuit boards and method of mounting component on boards

  • Type of boards
  • Securing and fixing of components
  • Preparation of component
  • Shaping and fixing of components
  • Bending and trimming
  • Order of mounting 

Soldering Technique 

  • Soldering a joint 
  • Stage in soldering
  • Selection and preparation of materials
  • Selection of soldering iron tip
  • Selection of tip shape
  • Selection of solder and flux
  • Soldering stand
  • Inspection of soldering iron
  • Preparation of soldering for soldering 
  • Cleaning the surfaces to be soldered
  • Heating the joint and adding solder
  • Cooling the joint 
  • Cleaning the joint 
  • Inception of soldered joint 
  • Surface colour
  • Surface texture
  • Common soldering defect
  • Temperature defects

Electromagnetic Induction

  • Inductance 
  • Cemf And Lenz’s law
  • Definition of self inductance
  • Henry 
  • Coil inductance
  • Mutual  inductance 
  • Magnitude of induced emf 
  • Factors derterming inductance 
  • Number of tune
  • Spacing between turns of the coil
  • Coefficient of self inductance
  • Energy storage 
  • Type of connection of heating 
  • Series inductors
  • Parallel induction
  • Application of induction for high voltage generation
  • Inductance effect in Dc
  • Opposite to current flow in dc circuit 
  • Effective opposition to current flow in Ac circuit 

Instant start fluorescent lamps

  • State the function of instant start ballast 

Rapid start fluorescent lamp

  • Advantage 
  • Instant start electronic ballets with fluorescent 
  • Compact fluorescent lamps 

Servicing of simple power supplies

  • Introduction
  • Physical and sensory tests
  • Symptom diagnosis
  • Testing and replacing defective components
  • High voltage passive 
  • Low power passive 

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