Table of Content
 

Resistors 

• Wire-wound resisters 
• Carbon composition resisters 
• Metal film resisters 
• Carbon film resistors 
• Specification of resistors
• PTC resistors ( Sensistors )
• NTC resistors (Thermistors)
• VDR (varistors)
• Light dependent resistors (LDR)
• Marketing codes for resistors 
• Resistors and tolerance value of color coded resistors
• Resistance value 
• Tolerance value 

Capacitors 

• Construction
• Function
• How a capacitor stores charge ?
• capacitance
• Sub-units of a farad 
• Factors determining capacitance 
• Area of the plates
• Distance between the plates 
• Type of dielectric material
• Temperature 
• Types of capacitors 
• Common defects in capacitors 

PN junction diodes 

• PN junction 
• The internal barrier potential (VB)
• Biasing the PN junction 
• V-I characteristic of PN junction 
• Application of diodes 
• Important specifications of diodes
• The material 
• Maximum safe reverse voltage 
• Maximum average forward current 
• Forward voltage drop 
• Maximum reverse current 
• Maximum forward surge current 
• The maximum junction temperature 
• Manufacturer’s code of Diodes 
• Diode equivalent 
• Classification of Diodes 
• Types of diode packaging 

Transistors and their classification

• Introduction to Transistors
• Based on semiconductor used 
• Based on the way P and N junction are organized 
• Based on the power handling capacity of transistors 
• Based on the frequency of application 
• Based on the manufacturing method 
• Based on the type of final packaging 
• INSIDE A TRANSISTOR 
• TESTING TRANSISTORS USING OHMMETER 
• Junction test 
• Quick TURN-ON test 

Printed circuit boards (PCBS) 

• Limitations of Tag-Lug boards 
• Printed circuit boards 

Printed circuit boards – etching, component side marking and mounting components 

• Etching 
• Drilling holes on PCBs 
• Preparing and marking component layout 
• Mounting components on PCB 
• Shaping the component leads 
• Due to the component weight 
• Due to shock 
• Due to vibration 
• Due to temperature 
• Stress relief measures 
• Order of soldering components

Types of electronic circuit boards and method of mounting component on boards

• Type of boards
• Securing and fixing of components
• Preparation of component
• Shaping and fixing of components
• Bending and trimming
• Order of mounting 

Soldering Technique 

• Soldering a joint 
• Stage in soldering
• Selection and preparation of materials
• Selection of soldering iron tip
• Selection of tip shape
• Selection of solder and flux
• Soldering stand
• Inspection of soldering iron
• Preparation of soldering for soldering 
• Cleaning the surfaces to be soldered
• Heating the joint and adding solder
• Cooling the joint 
• Cleaning the joint 
• Inception of soldered joint 
• Surface colour
• Surface texture
• Common soldering defect
• Temperature defects

Electromagnetic Induction

• Inductance 
• Cemf And Lenz’s law
• Definition of self inductance
• Henry 
• Coil inductance
• Mutual  inductance 
• Magnitude of induced emf 
• Factors derterming inductance 
• Number of tune
• Spacing between turns of the coil
• Coefficient of self inductance
• Energy storage 
• Type of connection of heating 
• Series inductors
• Parallel induction
• Application of induction for high voltage generation
• Inductance effect in Dc
• Opposite to current flow in dc circuit 
• Effective opposition to current flow in Ac circuit 

Instant start fluorescent lamps

• State the function of instant start ballast 

Rapid start fluorescent lamp

• Advantage 
• Instant start electronic ballets with fluorescent 
• Compact fluorescent lamps 

Servicing of simple power supplies

• Introduction
• Physical and sensory tests
• Symptom diagnosis
• Testing and replacing defective components
• High voltage passive 
• Low power passive